Let us now more and more about the RAM (Memory) and now still with Inside The Computers we will continue what is Ram Component?
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| Memory Chip Types |
CHIP PACKAGING
The type that often we use on the DDR memory module is TSOP (Thin Small Outline Package). On the RDRAM and DDR2 is using CSP (Chip Scale Package). Some of this chip memory module is using DIP (Dual In-Line Package) and SOJ (Small Outline J-Lead).
DIP (Dual In-Line Package)
This kind of chip memory used when the memory installed directly to motherboard PCB. DIP is the through-hole component category, which can install on the PCB through the holes which arrange for the pin.
SOJ (Small Outline J-Lead)
DRAM chip type SOJ. Called SOJ because the pin has form like the “J” letter. SOJ is surface-mount component, mean this component installed on the surface of PCB.
TSOP (Thin Small Outline Package)
It’s also surface-mount component.
CSP (Chip Scale Package)
If on the DIP, SOJ and TSOP use the feet/pin to connecting with the board, CSP didn’t use any pin. The connection is using BGA (Ball Grid Array) which place on the bottom of the component. This kind of DRAM chip is use by RDRAM (Rambus DRAM) and DDR.
Expensive and sophisticated technology make the Fiber Optic communication media become the main options for the users who want good quality in communicate.
The type that often we use on the DDR memory module is TSOP (Thin Small Outline Package). On the RDRAM and DDR2 is using CSP (Chip Scale Package). Some of this chip memory module is using DIP (Dual In-Line Package) and SOJ (Small Outline J-Lead).
DIP (Dual In-Line Package)
This kind of chip memory used when the memory installed directly to motherboard PCB. DIP is the through-hole component category, which can install on the PCB through the holes which arrange for the pin.
SOJ (Small Outline J-Lead)
DRAM chip type SOJ. Called SOJ because the pin has form like the “J” letter. SOJ is surface-mount component, mean this component installed on the surface of PCB.
TSOP (Thin Small Outline Package)
It’s also surface-mount component.
CSP (Chip Scale Package)
If on the DIP, SOJ and TSOP use the feet/pin to connecting with the board, CSP didn’t use any pin. The connection is using BGA (Ball Grid Array) which place on the bottom of the component. This kind of DRAM chip is use by RDRAM (Rambus DRAM) and DDR.
Expensive and sophisticated technology make the Fiber Optic communication media become the main options for the users who want good quality in communicate.
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